三星半导体（中国）研究开发有限公司，简称三星半导体中国研究所，是韩国三星电子株式会社投资七百万美金在中国设立的全资研发法人，研究所分别在素有人间天堂之称的苏州和杭州设有“苏州集成封装技术研发中心”和“杭州系统解决方案研发中心”。
苏州研发中心的主要业务是封装技术的研究与开发。杭州研发中心的主要业务是集成电路设计及系统解决方案的开发。
立足中国，面向世界，三星半导体中国研究所的目标是成为三星半导体的第二个研发中心，为中国市场提供Total Solution。
三星半导体（中国）研究所热忱欢迎每一位有智之士的加盟！

地址：中国杭州市滨江区江南大道380号威陵大厦8-13层
邮政编码：310052
电话：（571）8672 6288
Email: ssc.sscr@samsung.com
请将详细中英文简历发往以上邮箱地址，谢谢！

Mobile Solution Application Engineer           
职位描述：           
Develop and optimize application based on embedded system (Linux, Wince, Windows Mobile. )                  

应聘要求：            
Bachelor, Master or docotor in Electronic Engineering, Computer, Communication or related major     
Strong C /C++ programming skill.          
Windows or Linux Application develop experience, with working experience on Embedded System (Linux, WinCE, Window Mobile) application development are preferred
People with experience for mass product of Mobile Phone, PDA, Smart Phone, PND are preferred.     
people with skills of embedded UI, multimedia , Graphic are preferred.       
Good English skill.           
Excellent communication, team work and adaptability        
Strong sense of responsibility in given tasks.          

Mobile Solution BSP Engineer        
职位描述：                        
Develop and optimize BSP and device driver based on ARM9 and ARM11 series                           

应聘要求：            
Bachelor, Master or docotor in Electronic Engineering, Computer, Communication or related major     
Strong C programming skill.          
Moible Phone BSP develop experience, with working experience on Embedded System (Linux, WinCE, Window Mobile) BSP development are preferred 
People with experience for mass product of Mobile Phone , PDA, Smart Phone, PND are preferred.     
Good English skill.           
Excellent communication, team work and adaptability        
Strong sense of responsibility in given tasks.          
                 
Mobile Soiution CS BSP Engineer      
职位描述：                         
Develop and optimize BSP and device driver based on ARM9 and ARM11 series      
Customer project technology supporting and management          

应聘要求：            
Bachelor, Master or docotor in Electronic Engineering, Computer, Communication or related major     
Strong C programming skill.          
Moible Phone BSP develop experience, with working experience on Embedded System (Linux, WinCE, Window Mobile) BSP development are preferred 
People with experience for mass product of Mobile Phone , PDA, Smart Phone, PND are preferred.     
Good English skill.           
Excellent communication, team work and adaptability        
Strong sense of responsibility in given tasks.          
Be able to adapt long times business trip
Mobile Solution Hardware Engineer       

职位描述：            
H/W system design & debug based on ARM9,11 for S/P, PND etc.       
H/W System Firmware debug.                        

应聘要求：                 
Bachelor, Master or doctor Electronic Engineering, Computer, Communication or related major     
H/W Schematic/PCB design and debug skill ,  with working experience on Mobile Phone H/W development are preferred   
People with experience for mass product of Mobile Phone , PDA, Smart Phone, PND are preferred.     
Good English Skill            
Excellent communication, team work and adaptability         
Strong sense of responsibility in given tasks.